RFID tag assemblies and process

摘要

A process is disclosed for attaching an RFID tag such as an AK module or QFP package to a flexible surface such as textile or fabric. The process comprises providing a heat fusible label including at least a first layer having a first adhesive layer, a substrate layer including a secondary antenna structure, a heat activated second adhesive layer and a pressure sensitive adhesive (PSA) layer for holding the RFID tag. The process further includes positioning the RFID tag on the PSA layer, pressing the tag against the PSA layer such that the PSA layer holds the tag against the heat fusible label at least temporarily, positioning the heat fusible label with the RFID tag on the flexible surface and applying heat and pressure to the heat fusible label to melt the heat activated layer and to fuse the label to the flexible surface.

主权项

1. A process for attaching an RFID tag such as a QFP package to a flexible surface, said process comprising:
providing a heat fusible label including at least:
a) a first layer having a first adhesive layer;b) a substrate layer including a secondary antenna structure;c) a heat activated second adhesive layer; andd) a pressure sensitive adhesive (PSA) layer for holding said RFID tag, wherein said PSA layer is relatively thin and provides tack at room temperature; positioning said RFID tag on said PSA layer; pressing said tag against said PSA layer such that said PSA layer holds said tag against said heat fusible label at least temporarily; positioning said heat fusible label with said RFID tag on said flexible surface; and applying heat and pressure to said heat fusible label to melt said heat activated layer and to fuse said label to said flexible surface.