发明名称 Display substrate and method for repairing lead of driver integrated circuit
摘要 A display substrate and a method for repairing a lead of a driver integrated circuit. The display substrate comprises: multiple signal leads on the display substrate, at least one driver integrated circuit, at least one repair chip (RC), at least one repair lead, and at least one repair line (13). The RC is connected to the at least one driver integrated circuit, the repair lead is connected to the RC, and the repair line crosses signal lines connected to multiple signal leads, and is insulated from the signal lines. When the signal leads connected to the driver integrated circuit is in poor contact, the repair lead and the repair line (13) are used to replace the signal lead in poor contract, which solves a problem that an existing display substrate cannot repair a signal lead in poor contact in an outer lead region, causing wastes of products, and improving costs of the products.
申请公布号 US9625779(B2) 申请公布日期 2017.04.18
申请号 US201314424257 申请日期 2013.12.24
申请人 BOE TECHNOLOGY GROUP CO., LTD.;HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 Wang Hui;Xia Long
分类号 G02F1/1362;G02F1/1345 主分类号 G02F1/1362
代理机构 Ladas & Parry LLP 代理人 Ladas & Parry LLP
主权项 1. A display substrate, comprising: a plurality of signal leads, at least one driver integrated circuit (IC), at least one repair chip, at least one repair lead and at least one repair line disposed on the display substrate, wherein the repair chip is connected with the at least one driver IC; the repair lead is connected with the repair chip; the repair line is intersected with a plurality of signal lines connected with the plurality of signal leads and insulated from the signal lines; the driver IC is configured to output signals, outputted to a defective signal lead, to the repair chip in the case of the defective signal lead occurring among the signal leads connected with the driver IC; the repair chip is configured to output a signal which is outputted by the driver IC to the repair lead connected with the repair chip; the repair lead is configured to transmit a signal outputted by the repair chip to the corresponding repair line; and when the repair line receives the signal from the repair lead, the connection between the repair line and a signal line connected to the defective signal lead is conductive, and hence the repair line transmits the signal to the signal line.
地址 Beijing CN