Land grid array socket for electro-optical modules

摘要

An LGA socket suitable for electro-optical modules, such as transceivers having channels operable at 25 Gbit/s, or greater. A socket may include a socket body having a bottom side to face a printed circuit board (PCB), and a backstop on a top side to receive a leading edge of a module substrate. The backstop has an overhang to contact a first side of the module substrate when seated into the socket body. The socket further includes a first and a second row of electrical contacts, the first row being more proximate to the backstop than is the second row. Contacts extend through the socket body between the top and bottom sides and are positioned relative to the overhang to be compressed against contact pads on a second side of the module substrate by a torque applied to the module substrate about a fulcrum within the socket body.

主权项

1. An integrated circuit (IC) module socket, comprising:
a dielectric socket body with a bottom side to face a printed circuit board (PCB); a backstop monolithically integrated with the socket body to laterally position a leading edge of an IC module substrate relative to the socket body, the backstop further comprising at least three top-side supports defined by four reliefs, a pair of the reliefs defining opposite sides of a first support; a metal overhang positioned over the socket body top-side supports to contact a first side of the IC module substrate when the substrate is seated on the socket body, the overhang further comprising a plurality of spring clips, each with an under-hanging clip member aligned within one of the reliefs to contact the first module substrate side, with a pair of the clips separated from one another by a portion of the overhang that is positioned over the first support, and is separated from each of the clips by a relief in the overhang; and a first and a second row of electrical contacts, the first row being more proximate to the backstop than is the second row, and each row including at least one contact extending through the socket body between the bottom side and a top side, and positioned relative to the overhang to be compressed against a contact pad disposed on a second side of the module substrate by a torque applied to the module substrate about a fulcrum within the socket.