Method of making a wire support leadframe for a semiconductor device

摘要

A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

主权项

1. A method of forming a circuit comprising:
forming a leadframe having a plurality of interconnected support members, a pair of die pads connected to the support members, and a support bracket extending between the die pads, the support bracket having an upper surface; applying an insulating layer to the upper surface of the support bracket; securing a pair of dies to the respective die pads, each die having an upper surface; electrically connecting the dies with at least one wire such that the at least one wire extends over the upper surface of the support bracket; and overmolding the leadframe with an electrically insulating material, the upper surface of the support bracket spacing a portion of the at least one wire above the upper surfaces of the dies during overmolding.