发明名称 |
Continuous process incorporating atomic layer etching |
摘要 |
A method of continuous fabrication of a layered structure on a substrate having a patterned recess, includes: (i) forming a dielectric layer on a substrate having a patterned recess in a reaction chamber by PEALD using a first RF power; (ii) continuously after completion of step (i) without breaking vacuum, etching the dielectric layer on the substrate in the reaction chamber by PEALE using a second RF power, wherein a pressure of the reaction chamber is controlled at 30 Pa to 1,333 Pa throughout steps (i) and (ii); a noble gas is supplied to the reaction chamber continuously throughout steps (i) and (ii); and the second RF power is higher than the first RF power. |
申请公布号 |
US9627221(B1) |
申请公布日期 |
2017.04.18 |
申请号 |
US201514981434 |
申请日期 |
2015.12.28 |
申请人 |
ASM IP Holding B.V. |
发明人 |
Zaitsu Masaru;Fukazawa Atsuki;Fukuda Hideaki |
分类号 |
H01L21/311;H01L21/02 |
主分类号 |
H01L21/311 |
代理机构 |
Snell & Wilmer LLP |
代理人 |
Snell & Wilmer LLP |
主权项 |
1. A method of continuous fabrication of a layered structure on a substrate having a patterned recess, comprising:
(i) forming a dielectric layer on a substrate having a patterned recess in a reaction chamber by plasma-enhanced atomic layer deposition (PEALD) using a first RF power; (ii) continuously from completion of step (i) without breaking vacuum, etching the dielectric layer on the substrate in the reaction chamber by plasma-enhanced atomic layer etching (PEALE) using a second RF power, wherein a pressure of the reaction chamber is controlled at 30 Pa to 1,333 Pa throughout steps (i) and (ii); a noble gas is supplied to the reaction chamber continuously throughout steps (i) and (ii); and the second RF power is higher than the first RF power. |
地址 |
Almere NL |