发明名称 |
Electronic device and method for fabricating the same |
摘要 |
An electronic device comprising a semiconductor memory unit that includes a resistance variable element formed over a substrate, and including stacked therein a bottom electrode, a variable resistance layer and a top electrode, and a barrier layer formed over the resistance variable element, and including an amorphous silicon layer which is doped with at least one kind of impurity. |
申请公布号 |
US9627616(B2) |
申请公布日期 |
2017.04.18 |
申请号 |
US201414225354 |
申请日期 |
2014.03.25 |
申请人 |
SK hynix Inc. |
发明人 |
Kim Sook-Joo;Oh Jae-Geun;Lee Keum-Bum;Lee Hyung-Suk |
分类号 |
H01L21/00;H01L45/00;H01L43/12 |
主分类号 |
H01L21/00 |
代理机构 |
Perkins Coie LLP |
代理人 |
Perkins Coie LLP |
主权项 |
1. A method for fabricating an electronic device, comprising:
forming a target processing layer; forming a barrier layer over the target processing layer to include an amorphous silicon layer which is doped with one or more impurities as a mask layer to protect, in subsequent processing, each area of the target processing layer covered by the barrier layer; patterning the barrier layer to form a patterned barrier layer for patterning the target processing layer; and etching the target processing layer using the patterned barrier layer, wherein the target processing layer includes a variable resistance layer that switches between two different resistance states. |
地址 |
Icheon-Si KR |