发明名称 |
Field effect transistors with strained channel features |
摘要 |
A method is provided for forming an integrated circuit. A doped silicon layer is formed on a silicon substrate. A silicon-germanium layer is subsequently formed on the doped silicon layer. The silicon-germanium layer is pattered to form a silicon-germanium feature. A silicon shell is formed on the silicon-germanium feature. At least a portion of the dopes silicon layer is converted to a porous silicon layer. Following the last step, the silicon shell is tensily stressed, making it a good candidate for use as a channel feature in an n-type field effect transistor. |
申请公布号 |
US9627536(B2) |
申请公布日期 |
2017.04.18 |
申请号 |
US201514749827 |
申请日期 |
2015.06.25 |
申请人 |
International Busines Machines Corporation |
发明人 |
Balakrishnan Karthik;Cheng Kangguo;Hashemi Pouya;Reznicek Alexander |
分类号 |
H01L29/78;H01L21/02;H01L29/66;H01L29/06;H01L29/10;H01L29/165 |
主分类号 |
H01L29/78 |
代理机构 |
Otterstedt, Ellenbogen & Kammer, LLP |
代理人 |
Percello, Esq. Louis J.;Otterstedt, Ellenbogen & Kammer, LLP |
主权项 |
1. A method for forming an integrated circuit comprising the steps of:
forming a doped silicon layer on a silicon substrate; forming a silicon-germanium layer on the doped silicon layer; patterning the silicon-germanium layer to form a silicon-germanium feature; forming a silicon shell on the silicon-germanium feature; and converting at least a portion of the doped silicon layer to a porous silicon layer after forming the silicon shell. |
地址 |
Armonk NY US |