发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
A semiconductor device includes: a stacked unit including a semiconductor module and a plurality of coolers each having a flow passage through which a coolant flows, the semiconductor module being disposed between the coolers; a coolant supply-discharge pipe configured to supply the coolant to the coolers or discharge the coolant from the coolers, the coolant supply-discharge pipe being passed through the stacked unit in a stacking direction of the stacked unit; a displacement restricting member provided at a first end portion of the coolant supply-discharge pipe, the displacement restricting member being configured to restrict displacement of the stacked unit in the stacking direction of the stacked unit; and a pressurizing member provided at a second end portion of the coolant supply-discharge pipe, the pressurizing member being configured to apply force to the stacked unit in a direction toward the first end portion. |
申请公布号 |
US9627294(B2) |
申请公布日期 |
2017.04.18 |
申请号 |
US201514835166 |
申请日期 |
2015.08.25 |
申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
Kakiuchi Eisaku;Kinoshita Yasuo |
分类号 |
H05K5/00;H05K7/00;H01L23/473;H01L25/10;H01L21/48;H01L23/40 |
主分类号 |
H05K5/00 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. A semiconductor device comprising:
a stacked unit including a semiconductor module and a plurality of coolers each having a flow passage through which a coolant flows, the semiconductor module being disposed between the coolers; a coolant supply-discharge pipe configured to supply the coolant to the coolers or discharge the coolant from the coolers, the coolant supply-discharge pipe being passed through the stacked unit in a stacking direction of the stacked unit; a displacement restricting member provided at a first end portion of the coolant supply-discharge pipe, the displacement restricting member being configured to restrict displacement of the stacked unit in the stacking direction of the stacked unit; and a pressurizing member provided at a second end portion of the coolant supply-discharge pipe, the pressurizing member being configured to apply force to the stacked unit in a direction toward the first end portion, wherein: the coolant supply-discharge pipe passes through the coolers of the stacked unit; each of the coolers includes two partition plates that face each other across the flow passage in the stacking direction; each of the two partition plates has a through-hole through which the coolant supply-discharge pipe is passed; and at least one of the two partition plates has a guiding portion configured to guide the coolant supply-discharge pipe to the through-hole when the coolant supply-discharge pipe is inserted into the through-hole. |
地址 |
Toyota JP |