Package substrate

摘要

A package substrate is disclosed. The package substrate includes a molding layer, a redistribution structure, and a build-up structure. The redistribution structure is embedded in the molding layer with a surface exposed by the molding layer. The build-up structure is formed on the bottom surface of the molding layer. An inner stress caused by a CTE difference between different materials in the package substrate is reduced by forming at least one groove which is arranged around the periphery of the redistribution structure onto the top surface of the molding layer, thereby improving the problem of the redistribution structure cracking in the prior art.

主权项

1. A package substrate, comprising:
a redistribution structure having a plurality of top electrode pads, the plurality of top electrode pads being configured with a first density; a chip mounted on the plurality of top electrode pads; a build-up layer configured on bottom of the redistribution structure, the build-up layer having a plurality of bottom mounting pads, the plurality of bottom mounting pads being configured with a second density adaptive for the substrate to mount onto a printed circuit board, the second density being lower than the first density; a molding layer embedding the redistribution structure therein; and a groove extending around the redistribution structure, wherein the groove contains no conductive material, the redistribution structure and the groove are entirely below the chip, and the groove extends from a top surface of the molding layer, through an entire thickness of the molding layer, and into a portion of the build-up layer.