Methods and apparatus of packaging with interposers

摘要

Methods and apparatus for forming a semiconductor device package on an interposer using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, where a micro-bump is used as a vertical connection between a die and the interposer, and a micro-bump line is used as a horizontal connection for signal transmission between different dies above the interposer. The micro-bump lines may be formed at the same time as the formation of the micro-bumps with little or no additional cost.

主权项

1. A device comprising:
an interposer comprising:
an insulator layer at a top surface of the interposer; anda first contact pad over the insulator layer and electrically connected to a metal layer within the interposer; a first die and a second die over the interposer, wherein the first die is disposed laterally adjacent the second die; a first conductive feature electrically connecting the first die to the second die, wherein the first conductive feature is disposed between the insulator layer and the first die, and wherein the insulator layer covers an entire bottom surface of the first conductive feature; and a second conductive feature electrically connecting the second die to the first contact pad.