Method for forming features in a silicon containing layer

摘要

Embodiments of methods for forming features in a silicon containing layer of a substrate disposed on a substrate support are provided herein. In some embodiments, a method for forming features in a silicon containing layer of a substrate disposed on a substrate support in a processing volume of a process chamber includes: exposing the substrate to a first plasma formed from a first process gas while providing a bias power to the substrate support, wherein the first process gas comprises one or more of a chlorine-containing gas or a bromine containing gas; and exposing the substrate to a second plasma formed from a second process gas while no bias power is provided to the substrate support, wherein the second process gas comprises one or more of an oxygen-containing gas or nitrogen gas, and wherein a source power provided to form the first plasma and the second plasma is continuously provided.

主权项

1. A method for forming features in a silicon containing layer of a substrate having a patterned layer disposed atop the silicon containing layer to define one or more features to be etched into the silicon containing layer, the method comprising:
a) exposing the substrate to a first plasma formed from a first process gas while providing a bias power to a substrate support supporting the substrate, wherein the first process gas comprises one or more of a chlorine-containing gas or a bromine containing gas; and b) exposing the substrate to a second plasma formed from a second process gas while no bias power is provided to the substrate support to oxidize and/or nitridize sidewalls of the one or more features with limited oxidation and/or nitridation on a bottom of the one or more features, wherein the second process gas comprises one or more of an oxygen-containing gas or nitrogen gas, and wherein a source power provided to form the first plasma and the second plasma is continuously provided while exposing the substrate to the first plasma and up to and including while exposing the substrate to the second plasma.