| 发明名称 |
ELEMENT SUBSTRATE FOR LIQUID EJECTING HEAD AND WAFER |
| 摘要 |
An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded. |
| 申请公布号 |
US2017100930(A1) |
申请公布日期 |
2017.04.13 |
| 申请号 |
US201615287379 |
申请日期 |
2016.10.06 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Oohashi Ryoji;Omata Koichi;Tamura Hideo;Yamaguchi Takaaki;Kubo Kousuke;Taniguchi Suguru;Tamaru Yuji;Negishi Toshio;Osuki Yohei |
| 分类号 |
B41J2/14 |
主分类号 |
B41J2/14 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. An element substrate for a liquid ejecting head comprising:
a substrate; an element forming layer on the substrate, the element forming layer including an energy generating element configured to provide energy to a liquid for ejection; a discharge port forming member formed of an insulating member on the element forming layer, the discharge port forming member including a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer, the exterior side surface having a first edge facing the element forming layer; and a conductive layer disposed between the first edge and the element forming layer and grounded. |
| 地址 |
Tokyo JP |
