| 发明名称 |
Electronic Component and Process of Producing Electronic Component |
| 摘要 |
Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed. |
| 申请公布号 |
US2017100916(A1) |
申请公布日期 |
2017.04.13 |
| 申请号 |
US201514881041 |
申请日期 |
2015.10.12 |
| 申请人 |
Tyco Electronics Corporation ;TE Connectivity Germany GmbH |
发明人 |
Bharadwaj Lavanya;Mathews Barry C.;Freckmann Dominique;Soneja Shallu;Oar Michael A.;Gulsoy Gokce;Schmidt Helge;Leidner Michael;Sachs Soenke |
| 分类号 |
B32B15/04;B32B37/08;B32B37/06 |
主分类号 |
B32B15/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component, comprising:
a substrate; and a thermal grain modified layer positioned on the substrate; wherein the thermal grain modified layer includes a modified grain structure, the modified grain structure including a thermal grain modification additive. |
| 地址 |
Berwyn PA US |
