| 主权项 |
1. A method of making a semiconductor device, comprising:
forming an embedded die panel by encapsulating at least four side surfaces and an active surface of a first semiconductor die, a second semiconductor die, and side surfaces of conductive interconnects coupled to the first semiconductor die and the second semiconductor die with encapsulant in a single step; measuring an actual position of the first semiconductor die and an actual position of the second semiconductor die within the embedded die panel to obtain a rotation measurement of the first semiconductor die, a XY shift of the first semiconductor die, a rotation measurement of the second semiconductor die, and a XY shift of the second semiconductor die; and interconnecting the conductive interconnects of the first semiconductor die and the second semiconductor die by forming a build-up interconnect structure over the embedded die panel, the build-up interconnect structure being formed by:
forming a first unit specific alignment portion aligned with the first semiconductor die,forming a second unit specific alignment portion aligned with the second semiconductor die,forming unit specific routing connecting the first unit specific alignment portion and the second unit specific alignment portion, andforming a fixed portion aligned with outline of embedded die panel and coupled to the unit specific routing. |
