CIRCUIT BOARD AND POWER SUPPLY APPARATUS

摘要

A circuit board includes a base substrate, a busbar disposed on a mounting surface-side of the base substrate; and an electronic component disposed on the mounting surface-side and including a plurality of terminals, at least one of which is soldered to a component connecting end portion extending from the busbar. The base substrate has an opening into which the component connecting end portion can be inserted. A first insertion portion through which the terminal can be inserted is provided in the component connecting end portion. The busbar is fixed to the base substrate so that the component connecting end portion is inserted into the opening with a soldering surface, on a side of the component connecting end portion where the terminal inserted through the first insertion portion protrudes, positioned closer to a rear surface of the base substrate than the component mounting surface.

主权项

1. A circuit board comprising:
a base substrate; a busbar disposed on a component mounting surface side of the base substrate; and an electronic component that is disposed on the component mounting surface side of the base substrate and has a plurality of connection terminals, at least one of which is soldered to a component connecting end portion that extends from a base portion of the busbar, wherein the base substrate is provided with an opening portion into which the component connecting end portion is capable of being inserted, a first insertion portion through which the connection terminal can be inserted is provided in the component connecting end portion, and the busbar is fixed to the base substrate in a state where the component connecting end portion has been inserted into the opening portion with a soldering surface, which is located on a side of the component connecting end portion where the connection terminal that has been inserted through the first insertion portion protrudes, is positioned closer to a rear surface side of the base substrate than the component mounting surface of the base substrate.