| 发明名称 |
INTEGRATED HEAT SPREADER AND EMI SHIELD |
| 摘要 |
An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad. |
| 申请公布号 |
US2017105278(A1) |
申请公布日期 |
2017.04.13 |
| 申请号 |
US201514881915 |
申请日期 |
2015.10.13 |
| 申请人 |
GOOGLE INC. |
发明人 |
Cooper James;Lilje Joshua Norman |
| 分类号 |
H05K1/02;H05K3/32;H05K3/30;H05K1/18;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
a printed circuit board (PCB), the PCB including at least one grounding pad; an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad; and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit, wherein the frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad. |
| 地址 |
Mountain View CA US |
