| 发明名称 |
IMAGE PICKUP ELEMENT MOUNTING SUBSTRATE AND IMAGE PICKUP DEVICE |
| 摘要 |
An image pickup element mounting substrate includes: a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body; an electronic component mounted on a lower surface side of the frame body; and a flat plate which is disposed on a lower surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate including an image pickup element mounting section at a part of an upper surface thereof which part is surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate. |
| 申请公布号 |
US2017104022(A1) |
申请公布日期 |
2017.04.13 |
| 申请号 |
US201515316916 |
申请日期 |
2015.06.24 |
| 申请人 |
KYOCERA Corporation |
发明人 |
OKAMURA Takuji;FUNAHASHI Akihiko |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An image pickup element mounting substrate, comprising:
a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body; an electronic component mounted on a lower surface side of the frame body; and a flat plate which is disposed on a lower surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate comprising an image pickup element mounting section at a part of an upper surface thereof which part is surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate. |
| 地址 |
Kyoto-shi, Kyoto JP |
