Method of Forming a Protective Coating for a Packaged Semiconductor Device

摘要

A packaged includes a flip-chip assembly. The flip-chip assembly includes a first semiconductor substrate having at least one integrated semiconductor device, and a second substrate connected to the first substrate. A main surface of the first semiconductor substrate faces and is spaced apart from the second substrate. The packaged semiconductor device further includes a parylene coating covering outer surfaces of the first semiconductor substrate and the second substrate. A first section of the main surface is exposed from the parylene coating.

主权项

1. A packaged semiconductor device, comprising:
a flip-chip assembly, comprising a first semiconductor substrate comprising at least one integrated semiconductor device, and a second substrate connected to the first substrate, wherein a main surface of the first semiconductor substrate faces and is spaced apart from the second substrate; a parylene coating covering outer surfaces of the first semiconductor substrate and the second substrate, wherein a first section of the main surface is exposed from the parylene coating.