METHOD OF MANUFACTURING BONDED BODY

摘要

Provided is a method of manufacturing a bonded body having a structure where a substrate and an electronic part are bonded to each other with a metal particle paste interposed therebetween. The method includes an assembled body forming step where the electronic part is mounted on the substrate with the metal particle paste interposed therebetween, an assembled body arranging step of arranging the assembled body between two heating plates opposite to one another, and a bonding step of bonding the substrate and the electronic part to each other by heating while applying pressure to the assembled body by moving at least one of two heating plates to the other of two heating plates. The bonding step is performed under a condition that a temperature of the assembled body is within 0° C. to 150° C. In the bonding step, a metal particle paste minimally generates a sintering reaction.

主权项

1. A method of manufacturing a bonded body having a structure where a substrate and an electronic part are bonded to each other with a metal particle paste interposed therebetween, the method comprising:
an assembled body forming step of forming an assembled body where the electronic part is mounted on the substrate with the metal particle paste interposed therebetween; an assembled body arranging step of arranging the assembled body between two heating plates arranged in an opposedly facing manner; and a bonding step of bonding the substrate and the electronic part to each other by heating while applying pressure to the assembled body by moving at least one of said two heating plates to the other of said two heating plates, wherein: the bonding step is performed under a condition that a temperature of the assembled body at the time of starting applying of the pressure to the assembled body by said two heating plates falls within a range of from 0° C. to 150° C., and in the assembled body arranging step, the assembled body is arranged in a space defined between said two heating plates at a position where the assembled body is in contact with neither one of said two heating plates.