SEMICONDUCTOR DEVICE

摘要

A semiconductor device according to embodiments described below includes an element region and a peripheral region. The element region is disposed on a substrate and semiconductor elements are collocated in the element region. The peripheral region is disposed on the substrate and surrounds the element region. The element region extends in a first direction parallel to the substrate and includes a plurality of wiring layers laminated on the substrate. The peripheral region includes a peripheral layer arranged to surround the element region. The peripheral layer includes a first part extending in the first direction and a second part extending in a second direction intersecting the first direction. The cross-section structures of the first part and the second part are different from one another.

主权项

1. A semiconductor device comprising:
an element region disposed on a substrate, semiconductor elements being collocated in the element region; and a peripheral region disposed on the substrate, the peripheral region surrounding the element region, wherein the element region extends in a first direction parallel to the substrate and includes a plurality of wiring layers laminated on the substrate, the peripheral region includes a peripheral layer arranged to surround the element region, the peripheral layer includes a first part extending in the first direction and a second part extending in a second direction intersecting the first direction, and the first part and the second part have mutually different cross-section structures.