发明名称 RADIO-FREQUENCY ISOLATION USING FRONT SIDE OPENING
摘要 A transistor device includes a transistor implemented over a semiconductor substrate, one or more dielectric layers formed over the transistor, and a handle wafer layer disposed on at least a portion of the one or more dielectric layers, the handle wafer layer including a topside trench defined at least in part by sidewall portions of the handle wafer layer.
申请公布号 US2017104540(A1) 申请公布日期 2017.04.13
申请号 US201615386987 申请日期 2016.12.21
申请人 SKYWORKS SOLUTIONS, INC. 发明人 MASON Jerod F.;BARTLE Dylan Charles;WHITEFIELD David Scott
分类号 H04B10/40;H01L23/00;H01L21/762;H01L27/12 主分类号 H04B10/40
代理机构 代理人
主权项 1. A transistor device comprising: a transistor implemented over a semiconductor substrate; one or more dielectric layers formed over the transistor; and a handle wafer layer disposed on at least a portion of the one or more dielectric layers, the handle wafer layer including a topside trench defined at least in part by sidewall portions of the handle wafer layer.
地址 Woburn MA US