| 发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE |
| 摘要 |
A method of manufacturing a semiconductor package includes preparing a package substrate including a semiconductor chip mounting region. A semiconductor chip is mounted in the semiconductor chip mounting region. A dam surrounding the semiconductor chip is formed. The formation of the dam includes depositing a first solution having a temperature below a set first temperature. A region under the semiconductor chip and a region defined by the dam are filled with an underfill by depositing the first solution having a temperature equal to or higher than the set first temperature. |
| 申请公布号 |
US2017103906(A1) |
申请公布日期 |
2017.04.13 |
| 申请号 |
US201615286828 |
申请日期 |
2016.10.06 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Han Seong-chan;Lee Young-rock;Kang Chang-kun;Lee Chil-hoon;Kim Han-ju |
| 分类号 |
H01L21/56;H01L21/48;H01L23/29 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor package, the method comprising:
preparing a package substrate including a semiconductor chip mounting region; mounting a semiconductor chip in the semiconductor chip mounting region; forming a dam surrounding the semiconductor chip by depositing a first solution having a temperature below a set first temperature; and filling a region under the semiconductor chip and a region defined by the dam with an underfill by depositing the first solution having a temperature equal to or higher than the set first temperature. |
| 地址 |
Suwon-si KR |
