| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
There is provided a semiconductor package that comprises a board; a semiconductor chip disposed on the board and having an installation recess; an adhesive layer disposed within the installation recess; and a sensor unit disposed on the adhesive layer. |
| 申请公布号 |
US2017101307(A1) |
申请公布日期 |
2017.04.13 |
| 申请号 |
US201615181480 |
申请日期 |
2016.06.14 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LIM Chang Hyun;LEE Tae Hun;JEONG Dae Hun |
| 分类号 |
B81B7/00;G01D11/24;H01L23/053;H01L25/16;H01L23/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a board; a semiconductor chip disposed on the board and having an installation recess; an adhesive layer disposed within the installation recess; and a sensor unit disposed on the adhesive layer. |
| 地址 |
Suwon-si KR |
