| 发明名称 |
PACKAGES FOR INTEGRATED CIRCUITS AND METHODS OF PACKAGING INTEGRATED CIRCUITS |
| 摘要 |
An integrated circuit package including an integrated circuit die including a first side and a second side opposite the first side, the first side including at least one magnetoresistive device formed thereon. The integrated circuit package also may include a first magnetic shield disposed on or adjacent the first side of the integrated circuit die, wherein the first magnetic shield is formed of a composite material. |
| 申请公布号 |
US2017104149(A1) |
申请公布日期 |
2017.04.13 |
| 申请号 |
US201615290849 |
申请日期 |
2016.10.11 |
| 申请人 |
Everspin Technologies, Inc. |
发明人 |
UGGE ANGELO V. |
| 分类号 |
H01L43/02;H01L43/08;H01L43/12;H01L27/22 |
主分类号 |
H01L43/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit package, comprising:
an integrated circuit die including a first side and a second side opposite the first side, the first side including at least one magnetoresistive device formed thereon; and a first magnetic shield disposed on or adjacent the first side of the integrated circuit die, wherein the first magnetic shield is formed of a composite material. |
| 地址 |
Chandler AZ US |
