| 发明名称 |
RESIN STRUCTURE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN, AND METHOD FOR MANUFACTURING SAID STRUCTURE |
| 摘要 |
In a resin structure including a resin molded body and a plurality of electronic components embedded in the resin molded body, (i) the resin molded body has a plurality of exposed surfaces on which electrodes of the plurality of electronic components are exposed, (ii) the resin molded body has a recess formed therein, and (iii) the recess has a bottom surface which is at least one of the plurality of exposed surfaces. |
| 申请公布号 |
US2017103950(A1) |
申请公布日期 |
2017.04.13 |
| 申请号 |
US201515128450 |
申请日期 |
2015.03.26 |
| 申请人 |
OMRON Corporation |
发明人 |
KAWAI Wakahiro |
| 分类号 |
H01L23/538;H01L23/00;H01L21/56;B29C45/14 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin structure comprising:
a resin molded body; and a plurality of electronic components embedded in the resin molded body, the resin molded body having a plurality of exposed surfaces on which electrodes of the plurality of electronic components are exposed, the resin molded body having a recess provided therein, the recess having a bottom surface which is at least one of the plurality of exposed surfaces. |
| 地址 |
Kyoto-shi, Kyoto JP |
