TEMPORARY ADHESION METHOD AND METHOD FOR PRODUCING THIN WAFER

摘要

The present invention is a temporary adhesion method for temporarily bonding a support and a wafer via a temporary adhesive material, including attaching the wafer to the support via the temporary adhesive material including a complex temporary adhesive material layer that consists of a thermoplastic resin layer (A) exhibiting a storage modulus E′ of 1 to 500 MPa and a tensile rupture strength of 5 to 50 MPa at 25° C. and a thermosetting polymer layer (B) exhibiting a storage modulus E′ of 1 to 1000 MPa and a tensile rupture strength of 1 to 50 MPa at 25° C. after curing, wherein the attaching is performed by forming the layer (A) on the front surface of the wafer from a liquid composition (A′), forming the layer (B) on the support by laminating a film resin (B′), and then heating the wafer and the support under reduced pressure, or forming the layer (A) on the front surface of the wafer from the liquid composition (A′), forming the layer (B) on the layer (A) by laminating the film resin (B′), and then heating the wafer and the support under reduced pressure, and heat curing the layer (B). This temporary adhesion method facilitates temporary adhesion and separation and can increase productivity of thin wafers.

主权项

1. A temporary adhesion method for temporarily bonding a support and a wafer having a front surface on which a circuit is formed and a back surface to be processed via a temporary adhesive material for a wafer processing, the method comprising the steps of:
attaching the wafer to the support via the temporary adhesive material for a wafer processing including a two-layered complex temporary adhesive material layer that consists of a first temporary adhesive layer composed of a thermoplastic resin layer (A) exhibiting a storage modulus E′ of 1 to 500 MPa and a tensile rupture strength of 5 to 50 MPa at 25° C. and a second temporary adhesive layer composed of a thermosetting polymer layer (B) exhibiting a storage modulus E′ of 1 to 1000 MPa and a tensile rupture strength of 1 to 50 MPa at 25° C. after curing, wherein the attaching is performed by forming the thermoplastic resin layer (A) on the front surface of the wafer from a liquid composition (A′) containing a thermoplastic resin, forming the thermosetting polymer layer (B) on the support by laminating a film resin (B′) that has been formed from a composition containing a thermosetting polymer, and then heating the wafer and the support under reduced pressure, or forming the thermoplastic resin layer (A) on the front surface of the wafer from the liquid composition (A′), forming the thermosetting polymer layer (B) on the resin layer (A) by laminating the film resin (B′), and then heating the wafer and the support under reduced pressure; and adhesively bonding the thermoplastic resin layer (A) and the thermosetting polymer layer (B) by heat curing the thermosetting polymer layer (B).