LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS INCLUDING THE SAME

摘要

Alight emitting device package may include a printed circuit board and a plurality of light emitting devices mounted on the printed circuit board, wherein a first light emitting device of the plurality of light emitting devices may comprise first to fourth conductor pads formed discretely on the bottom surface of the light emitting device, the printed circuit board comprises first to fourth conductor patterns formed discretely on the top surface of the printed circuit board, and the first to fourth conductor patterns are connected to respective first to fourth conductor pads by respective first to fourth solders.

主权项

1. A light emitting device package comprising:
a printed circuit board; and a plurality of light emitting devices mounted on the printed circuit board, wherein a first light emitting device of the plurality of light emitting devices comprises first to fourth conductor pads formed discretely on the bottom surface of the light emitting device, the printed circuit board comprises first to fourth conductor patterns formed discretely on the top surface of the printed circuit board, and the first to fourth conductor patterns are connected to respective first to fourth conductor pads by respective first to fourth solders, wherein all of the first to fourth conductor patterns are not electrically connected to each other with respect to electrical connections of the printed circuit board, wherein at least two of the first to fourth conductor patterns are electrically connected by an electrical connection of the first light emitting device between at least two of the first to fourth conductor pads .