ELECTRONIC MODULE WITH FREE-FORMED SELF-SUPPORTED VERTICAL INTERCONNECTS

摘要

An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic components disposed on a cover substrate with base electronic components disposed on a base substrate. The free-formed, self-supported interconnect pillars may extend vertically in a straight path between the cover electronic components and the base electronic components. The free-formed, self-supported interconnect pillars may be formed from an electrically conductive filament provided by an additive manufacturing process. By free-forming the self-supported interconnect pillars directly on the electronic components, the flexibility of electronic module design may be enhanced, while reducing the complexity and cost to manufacture such electronic modules.

主权项

1. A method for assembling an electronic module comprising the steps:
mounting a base electronic component on a base substrate; mounting a cover electronic component on a cover substrate; depositing an electrically conductive filament directly on the base electronic component or directly on the cover electronic component; free-forming a self-supported interconnect pillar with the deposited electrically conductive filament, the free-formed, self-supported interconnect pillar extending upright from the base electronic component or the cover electronic component; arranging the cover substrate over the opposing base substrate and aligning the base electronic component with the cover electronic component; and electrically connecting the base electronic component to the cover electronic component with the free-formed, self-supported interconnect pillar.