发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises a substrate, a gate structure over a first surface of the substrate, and a source region and a drain region in the substrate adjacent to the gate structure. The semiconductor structure further comprises a channel region interposing the source and drain regions and underlying the gate structure. The semiconductor structure further comprises a first layer over a second surface of the substrate opposite to the first surface, and a second layer over the first layer. The semiconductor structure further comprises a sensing film over the channel region and at least a portion of the first and second layers, and a well over the sensing film and cutting off the first layer and the second layer.
申请公布号 US2017102356(A1) 申请公布日期 2017.04.13
申请号 US201514878999 申请日期 2015.10.08
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. 发明人 LIN SHIH-WEI;WU CHANG-MING;TSENG LEE-CHUAN;LIU SHIH-CHANG
分类号 G01N27/414 主分类号 G01N27/414
代理机构 代理人
主权项 1. A semiconductor structure, comprising: a substrate; a gate structure over a first surface of the substrate; a source region and a drain region in the substrate adjacent to the gate structure; a channel region interposing the source and drain regions and underlying the gate structure; a first layer over a second surface of the substrate opposite to the first surface; a second layer over the first layer; a sensing film over the channel region and at least a portion of the first and second layers; and a well over the sensing film, the well being defined by a first opening in the first layer and a second opening in the second layer, wherein a width of the first opening is greater than a width of the second opening.
地址 HSINCHU TW