发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises a substrate, a gate structure over a first surface of the substrate, and a source region and a drain region in the substrate adjacent to the gate structure. The semiconductor structure further comprises a channel region interposing the source and drain regions and underlying the gate structure. The semiconductor structure further comprises a first layer over a second surface of the substrate opposite to the first surface, and a second layer over the first layer. The semiconductor structure further comprises a sensing film over the channel region and at least a portion of the first and second layers, and a well over the sensing film and cutting off the first layer and the second layer. |
申请公布号 |
US2017102356(A1) |
申请公布日期 |
2017.04.13 |
申请号 |
US201514878999 |
申请日期 |
2015.10.08 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
LIN SHIH-WEI;WU CHANG-MING;TSENG LEE-CHUAN;LIU SHIH-CHANG |
分类号 |
G01N27/414 |
主分类号 |
G01N27/414 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor structure, comprising:
a substrate; a gate structure over a first surface of the substrate; a source region and a drain region in the substrate adjacent to the gate structure; a channel region interposing the source and drain regions and underlying the gate structure; a first layer over a second surface of the substrate opposite to the first surface; a second layer over the first layer; a sensing film over the channel region and at least a portion of the first and second layers; and a well over the sensing film, the well being defined by a first opening in the first layer and a second opening in the second layer, wherein a width of the first opening is greater than a width of the second opening. |
地址 |
HSINCHU TW |