Semiconductor device having a transparent window for passing radiation

摘要

Method of encapsulating a semiconductor structure comprising providing a semiconductor structure comprising an opto-electric element located in a cavity formed between a substrate and a cap layer, the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion on the cap layer; bringing the at least one protrusion of the cap layer in contact with a tool having a flat surface region, and applying a opaque material to the semiconductor structure where it is not in contact with the tool; and removing the tool thereby providing an encapsulated optical semiconductor device having a transparent window integrally formed with the cap layer.

主权项

1. A packaged optical semiconductor device having a transparent window, comprising:
a substrate comprising a transparent cap layer directly connected to the substrate, and an opto-electric element located in a cavity formed between the substrate and the transparent cap layer; the cap layer being made of quartz glass, sapphire glass or silicon, and having at least one protrusion extending on top of a substantially flat upper surface, the protrusion being integrally formed with the cap layer; an encapsulating layer made of an opaque material applied to at least the substantially flat portion of the cap layer and to a side surface of the at least one protrusion, a top surface of the protrusion being substantially flush with an outer surface of the encapsulating layer.