Light emitting diode device with reconstituted LED components on substrate

摘要

Disclosed herein are technologies for forming a plurality of known good die (KGD)-light emitting diode (LED) components into a larger size optically coherent LED chips or devices. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

主权项

1. A method of joining multiple light emitting diode (LED) components, the method comprising:
testing a wafer for a known good die (KGD)-LED component; flip chip bonding multiple KGD-LED components onto a substrate, the substrate includes redistribution layers (RDLs) that facilitate electrical connections between the KGD-LED components and an operating device; and under-filling a gap and spaces in between the KGD-LED components with a transparent material, wherein the transparent material is transparent to a light wavelength emitted by the LED components and has a refractive index close to a refractive index of the substrate that is transparent.