Integrated circuit package fabrication with die attach paddle having middle channels

摘要

A method of making an integrated circuit package. A leadframe having a die attach paddle surrounded by lead portions is formed. Middle channels underlying in said die attach paddle portion in a region thereof adapted to receive a first die are formed.

主权项

1. A method of making an integrated circuit die package comprising:
forming a leadframe having a die attach paddle portion surrounded by a plurality of lead portions, the die attach paddle portion adapted to receive a first die; half etching at least two middle channels in said die attach paddle portion; said at least two middle channels crossing in a middle region thereof; half etching a plurality of peripheral channels in said die attach paddle portion, the plurality of peripheral channels positioned to at least partially underlie peripheral portions of said first die; and mounting said first die on said die attach paddle portion of said leadframe, a nonconductive die attach film being coupled between said first die and said die attach paddle portion.