| 发明名称 | Integrated circuit packaging system with unplated leadframe and method of manufacture thereof | ||
| 摘要 | An integrated circuit packaging system and method of manufacture thereof including: providing an unplated leadframe having a contact protrusion; forming a contact pad and traces by etching the unplated leadframe; applying a trace protection layer on the contact pad and the traces; forming a recess in the trace protection layer by etching a top surface of the contact pad to a recess distance below a top surface of the trace protection layer; and depositing an external connector directly on the top surface of the contact pad. | ||
| 申请公布号 | US9620480(B1) | 申请公布日期 | 2017.04.11 |
| 申请号 | US201313930287 | 申请日期 | 2013.06.28 |
| 申请人 | STATS ChipPAC Pte. Ltd | 发明人 | Dimaculangan Garret;Chua Linda Pei Ee;Do Byung Tai;Trasporto Arnel Senosa |
| 分类号 | H01L23/495;H01L23/52;H01L21/48;H01L21/56;H01L23/00 | 主分类号 | H01L23/495 |
| 代理机构 | Wong & Rees LLP | 代理人 | Wong & Rees LLP |
| 主权项 | 1. A method of manufacture of an integrated circuit packaging system comprising: forming a contact pad and traces by etching an unplated leadframe, the unplated leadframe having a contact protrusion; applying a trace protection layer on the contact pad and the traces; forming a recess in the trace protection layer by etching a top surface of the contact pad to a recess distance below a top surface of the trace protection layer; and depositing an external connector directly on the top surface of the contact pad. | ||
| 地址 | Singapore SG | ||