发明名称 Gas sensor package
摘要 Provided is a gas sensor package, including: a first substrate including a gas inflow hole; and a gas sensing element mounted to the first substrate and including a gas sensing portion disposed to correspond to the gas inflow hole.
申请公布号 US9618490(B2) 申请公布日期 2017.04.11
申请号 US201414503480 申请日期 2014.10.01
申请人 LG Innotek Co., Ltd. 发明人 Paik Jee Heum;Bae Yun Mi;Hwang Go Eun
分类号 G01N33/00;G01N27/12;H01C7/04;B81B7/00;H01L23/00 主分类号 G01N33/00
代理机构 KED & Associates LLP 代理人 KED & Associates LLP
主权项 1. A gas sensor package, comprising: a first substrate including a gas inflow hole and metal patterns; a gas sensing element mounted to the first substrate and including a gas sensing portion provided to correspond to the gas inflow hole and bonded to the metal patterns; metal filling portions connected to respective metal patterns of the first substrate, each of the metal filling portions protruding from a surface of the first substrate and passing through the first substrate; a second substrate, wherein each of the metal filling portions contacts the second substrate to connect the second substrate to the first substrate; and an output change portion mounted on the first substrate to change an output mode of the gas sensing element.
地址 Seoul KR