发明名称 |
Gas sensor package |
摘要 |
Provided is a gas sensor package, including: a first substrate including a gas inflow hole; and a gas sensing element mounted to the first substrate and including a gas sensing portion disposed to correspond to the gas inflow hole. |
申请公布号 |
US9618490(B2) |
申请公布日期 |
2017.04.11 |
申请号 |
US201414503480 |
申请日期 |
2014.10.01 |
申请人 |
LG Innotek Co., Ltd. |
发明人 |
Paik Jee Heum;Bae Yun Mi;Hwang Go Eun |
分类号 |
G01N33/00;G01N27/12;H01C7/04;B81B7/00;H01L23/00 |
主分类号 |
G01N33/00 |
代理机构 |
KED & Associates LLP |
代理人 |
KED & Associates LLP |
主权项 |
1. A gas sensor package, comprising:
a first substrate including a gas inflow hole and metal patterns; a gas sensing element mounted to the first substrate and including a gas sensing portion provided to correspond to the gas inflow hole and bonded to the metal patterns; metal filling portions connected to respective metal patterns of the first substrate, each of the metal filling portions protruding from a surface of the first substrate and passing through the first substrate; a second substrate, wherein each of the metal filling portions contacts the second substrate to connect the second substrate to the first substrate; and an output change portion mounted on the first substrate to change an output mode of the gas sensing element. |
地址 |
Seoul KR |