发明名称 |
Testing of semiconductor chips with microbumps |
摘要 |
A package includes a semiconductor chip. The semiconductor chip includes a test pad, and a plurality of microbump pads, wherein each microbump pad of the plurality of microbump pads is electrically connected to the test pad. The package further includes a substrate; and a plurality of microbumps configured to electrically connect the semiconductor chip to the substrate, wherein each microbump of the plurality of microbumps is electrically connected to a corresponding microbump pad of the plurality of microbump pads. The package further includes a package substrate, wherein the package substrate comprises a bump pad, wherein an area of the bump pad is greater than a combined area of the test pad and the plurality of microbump pads. The package further includes a bump configured to electrically connect the substrate to the package substrate. |
申请公布号 |
US9618572(B2) |
申请公布日期 |
2017.04.11 |
申请号 |
US201615170062 |
申请日期 |
2016.06.01 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Wu Wei-Cheng;Hu Hsien-Pin;Hou Shang-Yun;Jeng Shin-Puu;Yu Chen-Hua;Yang Chao-Hsiang |
分类号 |
H01R31/00;G01R31/28;H01L21/66;G01R1/04;G01R31/26;H01L23/00 |
主分类号 |
H01R31/00 |
代理机构 |
Eschweiler & Potashnik, LLC |
代理人 |
Eschweiler & Potashnik, LLC |
主权项 |
1. A package comprising:
a semiconductor chip, wherein the semiconductor chip comprises:
a test pad, anda plurality of microbump pads that are electrically connected to the test pad, wherein each microbump pad has a first surface area that is less than a second surface area of the test pad; a substrate; and a plurality of microbumps configured to electrically connect the semiconductor chip to the substrate, wherein each microbump of the plurality of microbumps is electrically connected to a corresponding microbump pad of the plurality of microbump pads. |
地址 |
Hsin-Chu TW |