发明名称 Bulk acoustic resonator device including temperature compensation structure comprising low acoustic impedance layer
摘要 An acoustic resonator device includes a temperature compensation structure disposed beneath the first electrode and above the substrate.
申请公布号 US9621126(B2) 申请公布日期 2017.04.11
申请号 US201414521406 申请日期 2014.10.22
申请人 Avago Technologies General IP (Singapore) Pte. Ltd. 发明人 Burak Dariusz;Zou Qiang;Tsuzuki Genichi
分类号 H03H9/02;H01L41/047;H03H3/007;H03H9/17;H03H3/04 主分类号 H03H9/02
代理机构 代理人
主权项 1. A bulk acoustic wave (BAW) resonator, comprising: a substrate comprising an acoustic reflector; a first electrode disposed over the substrate, the first electrode having a first acoustic impedance; a piezoelectric layer disposed over the first electrode; a second electrode disposed over the piezoelectric layer, the second electrode having a second acoustic impedance; and a temperature compensation structure disposed in the piezoelectric layer, the temperature compensation structure comprising: a first layer having a positive temperature coefficient; and a second layer having a third acoustic impedance that is lower than the first and the second acoustic impedances, wherein the second layer substantially encapsulates the first layer.
地址 Singapore SG