Silicone resin composition for sealant and power semiconductor module that uses this composition

摘要

A silicone resin composition is provided that exhibits an increased adhesiveness relative to insulating circuit substrates and can prevent bubble production even when moisture absorption has occurred, exhibits an excellent heat resistance, and is free of problems such as cracking. A silicone resin composition for use as a sealant for a power semiconductor module includes an insulating circuit substrate having a Cu layer formed on a surface thereof. The silicone resin composition is formed on the Cu layer of the insulating circuit substrate, and has, after curing, a penetration of 35 to 70 and an adhesive strength of 50 to 180 kPa between the silicone resin composition and the insulating circuit substrate. The penetration is measured in accordance with JIS K 2220.

主权项

1. A silicone resin composition for use as a sealant for a power semiconductor module that includes an insulating circuit substrate having a Cu layer formed on a surface thereof,
the silicone resin composition formed on the Cu layer of the insulating circuit substrate, the silicone resin composition having, after curing, a penetration of 35 to 70 and an adhesive strength of 50 to 180 kPa between the silicone resin composition and the insulating circuit substrate having the Cu layer thereof, the penetration being measured in accordance with JIS K 2220.