| 发明名称 | Resin composition and gate insulating film | ||
| 摘要 | A resin composition containing a resin (A) which contains a hydroxyl group and a cyanoalkyl group, an epoxy compound (B) which has two or more epoxy groups in its molecule, a curing agent (C) which has two or more hydroxyl groups in its molecule and has a hydroxyl value of 150 to 300 mgKOH/g, and a cross-linking agent (D) which has a structure represented by the general formula (1).;;(In the general formula (1), R1 and R2 are C1 to C20 alkyl groups, where R1 and R2 may be the same as each other or different from each other.) | ||
| 申请公布号 | US9617408(B2) | 申请公布日期 | 2017.04.11 |
| 申请号 | US201414907037 | 申请日期 | 2014.07.28 |
| 申请人 | ZEON CORPORATION | 发明人 | Tsutsumi Takashi |
| 分类号 | C08L29/04;H01L21/02;C08L5/00;H01L29/49;C08K5/21;C08K5/3445 | 主分类号 | C08L29/04 |
| 代理机构 | Westerman, Hattori, Daniels & Adrian, LLP | 代理人 | Westerman, Hattori, Daniels & Adrian, LLP |
| 主权项 | 1. A resin composition comprising: a resin (A) containing a hydroxyl group and a cyanoalkyl group; an epoxy compound (B) having two or more epoxy groups in its molecule; a curing agent (C) having two or more hydroxyl groups in its molecule and having a hydroxyl value of 150 to 300 mgKOH/g; and a cross-linking agent (D) having a structure represented by the following general formula (1), wherein, in the general formula (1), R1 and R2 are C1 to C20 alkyl groups, where R1 and R2 are the same as each other or different from each other: | ||
| 地址 | Tokyo JP | ||