Lead frame and light emitting diode package having the same

摘要

An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

主权项

1. A lead frame for mounting a plurality of light emitting chips, wherein the plurality of light emitting chips comprises a first light emitting chip and a second light emitting chip thereon, comprising:
a substrate; a bonding electrode embedded in the substrate and having a top surface, the bonding electrode comprises comprising a first bonding surface and a second bonding surface spaced apart from the first bonding surface; a first connecting electrode embedded in the substrate, and having a top surface, the first connecting electrode comprises a first connecting surface and a second connecting surface spaced apart from the first connecting surface; and a second connecting electrode embedded in the substrate and having a top surface, wherein the bonding electrode, the first connecting electrode, and the second connecting electrode are spaced from each other, and the top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed out of the substrate, and a reflector located on the top surface of the substrate, and separated by a dam to define a first receiving portion and a second receiving portion, wherein the first bonding surface and the second bonding surface of the bonding electrode, the first connecting surface and the second connecting surface of the first connecting electrode, and the top surface of the second connecting electrode are coplanar.