发明名称 Nonvolatile semiconductor memory element, nonvolatile semiconductor memory, and method for operating nonvolatile semiconductor memory element
摘要 According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory element including: a semiconductor substrate including: a source region; a drain region; and a channel region; a lower insulating film that is formed on the channel region; a charge storage film that is formed on the lower insulating film and that stores data; an upper insulating film that is formed on the charge storage film; and a control gate that is formed on the upper insulating film, wherein the upper insulating film includes: a first insulting film; and a second insulating film that is laminated with the first insulating film, and wherein the first insulating film is formed to have a trap level density larger than that of the second insulating film.
申请公布号 US9620653(B2) 申请公布日期 2017.04.11
申请号 US201514971743 申请日期 2015.12.16
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 Shingu Masao;Fujiki Jun;Yasuda Naoki;Muraoka Koichi
分类号 H01L29/51;H01L29/788;H01L21/28;H01L29/792;G11C11/40;G11C16/04;G11C16/12;G11C16/14;G11C16/26;H01L27/11556;H01L27/11582;H01L29/423;H01L29/49;G11C16/10;H01L27/11521 主分类号 H01L29/51
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A memory comprising: a semiconductor substrate; a lower electrode disposed above the semiconductor substrate; an insulating film disposed on the lower electrode; and an upper electrode disposed on the insulating film; wherein the insulating film includes: a first insulating film including Al oxide or Al oxynitride and having a thickness of 0.5 nm to 4 nm;a second insulating film disposed on the first insulating film and including Zr oxide; anda third insulating film disposed on the second insulating film and including Al oxide or Al oxynitride;wherein a thickness of the first insulating film is less than a thickness of the second insulating film.
地址 Minato-ku JP