Amplifier devices with in-package transmission line combiner

摘要

The embodiments described herein include amplifiers that are typically used in radio frequency (RF) applications. The amplifiers described herein use a combiner that is implemented inside the device package. Specifically, the amplifiers can be implemented with a combiner that includes a transmission line inside the device package, where the transmission line has a length between first and second ends configured to provide an impedance inverter between the outputs (e.g., drain terminals) of transistors in the amplifier.

主权项

1. An amplifier comprising:
a device package including an output lead and at least one input lead, the device package encasing:
a first amplifier with a first transistor including a first transistor output;a second amplifier with a second transistor including a second transistor output; anda combiner coupled to the first transistor output and the second transistor output, the combiner including a transmission line having a length configured to provide at least a portion of an impedance inverter between the first transistor output and the second transistor output, wherein the impedance inverter is configured to compensate for a first transistor parasitic capacitance and a second transistor parasitic capacitance, and wherein the impedance inverter further includes a first set of bond wires and a second set of bond wires.