发明名称 |
Alignment apparatus and substrate processing apparatus |
摘要 |
An alignment apparatus for aligning a wafer includes a mounting unit, an imaging unit, an elevation unit, and a controlling unit. The control unit outputs a control signal for controlling the elevation unit such that a luminance variation between the outer side and the inner side of the wafer obtained by the imaging unit becomes the same as a luminance variation obtained when the imaging unit is focused, for estimating a warpage state of the wafer based on an amount of relative movement of the imaging unit and the mounting unit with respect to a relative height position of the imaging unit and the mounting unit obtained when the imaging unit is focused on a reference wafer having no warpage, and for detecting the alignment mark of the wafer by the imaging unit by rotating the mounting unit in a state where the imaging unit is focused. |
申请公布号 |
US9620402(B2) |
申请公布日期 |
2017.04.11 |
申请号 |
US201514857656 |
申请日期 |
2015.09.17 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
Kodama Toshiaki;Yamauchi Toru |
分类号 |
G06T7/00;H01L21/68 |
主分类号 |
G06T7/00 |
代理机构 |
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代理人 |
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主权项 |
1. An alignment apparatus for aligning a wafer that is a circular substrate in a predetermined orientation by optically detecting an alignment mark formed at a backside of the wafer by rotating a mounting unit on which the wafer is mounted, comprising:
an imaging unit configured to image, from a position below the wafer, an imaging region having a strip shape extending in a diametrical direction of the wafer across a periphery of the wafer; an elevation unit configured to relatively move up and down the mounting unit or the imaging unit with respect to each other; a control unit configured to output a control signal for controlling the elevation unit such that a luminance variation between an outer side and an inner side of the wafer in a luminance distribution pattern in the diametrical direction of the wafer which is obtained by the imaging unit becomes a luminance variation obtained when the imaging unit is focused, for estimating a warpage state of the wafer based on an amount of relative movement of the imaging unit and the mounting unit with respect to a relative height position of the imaging unit and the mounting unit which is obtained when the imaging unit is focused on a reference wafer having no warpage, and for detecting the alignment mark of the wafer by the imaging unit by rotating the mounting unit in a state where the imaging unit is focused. |
地址 |
Tokyo JP |