Method for manufacturing energy harvester comprising piezoelectric polymer microstructure array

摘要

A method for manufacturing an energy harvester including a piezoelectric polymer microstructure array. The method includes: preparing a micro-column array of a piezoelectric polymer on a substrate; supplying a plate electrode as an upper electrode, allowing the substrate and the upper electrode to form a pair of plate electrodes; applying a DC voltage between the pair of the plate electrodes; heating the substrate to a temperature higher than a glass transition temperature of the piezoelectric polymer and performing rheological formation of the micro-column array with the DC voltage still being applied until the column array of the piezoelectric polymer reaches the upper electrode to form a mushroom-shaped structure array; and cooling and solidifying the piezoelectric polymer to obtain the piezoelectric energy harvester.

主权项

1. A method for manufacturing an energy harvester comprising a piezoelectric polymer microstructure array, the method comprising:
1) fabricating an array of circular holes on a surface of a silicon chip by photolithography and etching processes whereby obtaining an imprint mold, and performing surface treatment on the imprint mold; 2) using a first fluorine-doped tin oxide (FTO) or tin-doped indium oxide (ITO) conductive glass as a substrate; spin coating a layer of a piezoelectric polymer solution having a thickness of um scale on a surface of the substrate by a spin coater; and evaporating a solvent residue on a hot plate at 100° C.; 3) pressing the imprint mold after treatment on a polymer film with a pressure of 8 megapascal in an oven; raising a temperature in the oven to be higher than a glass transition temperature of the piezoelectric polymer; after between 10 and 30 min, cooling the imprint mold and the polymer film to room temperature; demolding the polymer film from the imprint mold, whereby forming a column array of the piezoelectric polymer on the substrate; 4) using a second FTO or ITO conductive glass as an upper electrode, and allowing the upper electrode and the substrate to form a pair of plate electrodes comprising an air gap therebetween; controlling the air gap between the upper electrode and the substrate to be between 2 and 4 times of a height of the column array by disposing a polyimide film therebetween; placing the pair of the plate electrodes into the oven; applying an external DC power supply by connecting a positive electrode thereof to the upper electrode and connecting a negative electrode thereof to the substrate; raising the temperature of the oven to be higher than the glass transition temperature of the piezoelectric polymer; regulating a voltage whereby enabling an electric force applied on the column array of the piezoelectric polymer o counteract a surface tension and a viscous resistance rheology; and maintaining the voltage for between 20 and 50 min until the column array of the piezoelectric polymer reaches the upper electrode to form a mushroom-shaped structure array; and 5) maintaining the voltage constantly, cooling the oven to room temperature and removing the voltage whereby obtaining a group of microstructure array of the piezoelectric polymer connected to the substrate and the upper electrode; removing the polyimide film from between the substrate and the upper electrode, whereby obtaining a piezoelectric energy harvester formed by the microstructure array of the piezoelectric polymer, the substrate, and the upper electrode.