| 发明名称 | Methods and apparatus for magnetic sensor having non-conductive die paddle | ||
| 摘要 | Methods and apparatus to provide a magnetic field sensor device including a magnetic sensor element, a die having wafer bumps, wherein the magnetic sensor element is positioned in relation to the die, and conductive leadfingers having respective portions electrically connected to the wafer bumps. In embodiments, the device includes a region about the magnetic sensor element that does not contain electrically conductive material for preventing eddy current flow. | ||
| 申请公布号 | US9620705(B2) | 申请公布日期 | 2017.04.11 |
| 申请号 | US201615049732 | 申请日期 | 2016.02.22 |
| 申请人 | Allegro MicroSystems, LLC | 发明人 | Milano Shaun D.;Doogue Michael C.;Taylor William P. |
| 分类号 | H01L23/00;H01L43/04;H01L23/495;H01L23/31;G01R33/00;H01L43/02;H01L43/12;G01R33/07;G01R33/09;H01L43/06;H01L43/08;H01L43/14 | 主分类号 | H01L23/00 |
| 代理机构 | Daly, Crowley, Mofford & Durkee, LLP | 代理人 | Daly, Crowley, Mofford & Durkee, LLP |
| 主权项 | 1. A magnetic field sensor device, comprising: a magnetic sensor element; a die having wafer bumps, wherein the magnetic sensor element is positioned in relation to the die; a non-conductive die paddle over which the die is disposed; conductive leadfingers having respective portions electrically connected to the wafer bumps; and a region about the magnetic sensor element that does not contain electrically conductive leadfinger material for preventing eddy current flow. | ||
| 地址 | Worcester MA US | ||