发明名称 |
Coating packaged chamber parts for semiconductor plasma apparatus |
摘要 |
An advanced coating for parts used in plasma processing chamber. The advanced coating is formed over an anodized surface that has not been sealed. After the coating is formed, the coated area is masked, and the remaining anodized surface is sealed. The porous and rough structure of the anodized but un-sealed aluminum enhances adhesion of the coating. However, to prevent particle generation, the exposed anodized surface is sealed after formation of the coating. The coating can be of yttria, formed by plasma enhanced atomic deposition techniques which results in a dense and smooth coating. |
申请公布号 |
US9617633(B2) |
申请公布日期 |
2017.04.11 |
申请号 |
US201314066584 |
申请日期 |
2013.10.29 |
申请人 |
Advanced Micro-Fabrication Equipment Inc, Shanghai |
发明人 |
He Xiaoming;Wan Lei;Xu Zhaoyang;Yang Ping;Zhang Hanting |
分类号 |
C25D11/24;C25D11/04;C23C14/00;C23C14/08;C23C14/32 |
主分类号 |
C25D11/24 |
代理机构 |
Womble Carlyle Sandridge & Rice LLP |
代理人 |
Womble Carlyle Sandridge & Rice LLP ;Bach, Esq. Joseph |
主权项 |
1. A method for fabricating a part for a plasma chamber, the method comprising:
obtaining a part made out of an aluminum or aluminum alloy; anodizing the part to form an anodized surface on the part, wherein the anodizing step is performed without a sealing step; coating a section of the anodized surface by material comprising yttrium-containing material; and sealing a section of the anodized surface which is not covered by the yttrium-containing coating. |
地址 |
Shanghai CN |