Via structure for optimizing signal porosity

摘要

An apparatus including a conductive stack structure includes an Mx layer interconnect on an Mx layer and extending in a first direction on a first track, an My layer interconnect on an My layer in which the My layer is a lower layer than the Mx layer, a first via stack coupled between the Mx layer interconnect and the My layer interconnect, a second via stack coupled between the Mx layer interconnect and the My layer interconnect, a second Mx layer interconnect extending in the first direction on a track immediately adjacent to the first track, and a third Mx layer interconnect extending in the first direction on a track immediately adjacent to the first track. The Mx layer interconnect is between the second Mx layer interconnect and the third Mx layer interconnect. The second Mx layer interconnect and the third Mx layer interconnect are uncoupled to each other.

主权项

1. An apparatus including a conductive stack structure, comprising:
a metal x (Mx) layer interconnect on an Mx layer and extending in a first direction on a first track; a metal y (My) layer interconnect on an My layer, the My layer being a lower layer than the Mx layer; a first via stack coupled between the Mx layer interconnect and the My layer interconnect, the first via stack including a first metal x-1 (Mx-1) layer interconnect on an Mx-1 layer and including a plurality of vias, the first Mx-1 layer interconnect being a higher layer than the My layer interconnect, the first Mx-1 layer interconnect extending in a second direction on a second track, the second direction being orthogonal to the first direction, the plurality of vias including a first via connected to the Mx layer interconnect and the first Mx-1 layer interconnect within an overlapping portion of the first track and the second track, the plurality of vias including a second via coupled between the My layer interconnect and the first Mx-1 layer interconnect, the second via being within an overlapping portion of the first track and the second track; a second via stack coupled between the Mx layer interconnect and the My layer interconnect, the second via stack including a second Mx-1 layer interconnect and a second plurality of vias, the second Mx-1 layer interconnect extending in the second direction on a third track, the second plurality of vias including a third via connected to the Mx layer interconnect and the second Mx-1 layer interconnect within an overlapping portion of the first track and the third track, the second plurality of vias including a fourth via coupled between the My layer interconnect and the second Mx-1 layer interconnect, the fourth via being within an overlapping portion of the first track and the third track; a second Mx layer interconnect extending in the first direction on a fourth track immediately adjacent to the first track; a third Mx layer interconnect extending in the first direction on a fifth track immediately adjacent to the first track, the Mx layer interconnect being between the second Mx layer interconnect and the third Mx layer interconnect, the second Mx layer interconnect and the third Mx layer interconnect being uncoupled to each other; a fourth Mx layer interconnect extending in the first direction on a sixth track immediately adjacent to the fourth track, the second Mx layer interconnect being between the Mx layer interconnect and the fourth Mx layer interconnect; a third via stack coupled between the fourth Mx layer interconnect and the My layer interconnect, the third via stack including the first Mx-1 layer interconnect and a third plurality of vias, the third plurality of vias including a fifth via connected to the fourth Mx layer interconnect and the first Mx-1 layer interconnect within an overlapping portion of the sixth track and the second track, the third plurality of vias including a sixth via coupled between the My layer interconnect and the first Mx-1 layer interconnect, the sixth via being within an overlapping portion of the sixth track and the second track; and a fourth via stack coupled between the fourth Mx layer interconnect and the My layer interconnect, the fourth via stack including the second Mx-1 layer interconnect and a fourth plurality of vias, the fourth plurality of vias including a seventh via connected to the fourth Mx layer interconnect and the second Mx-1 layer interconnect within an overlapping portion of the sixth track and the third track, the fourth plurality of vias including an eighth via coupled between the My layer interconnect and the second Mx-1 layer interconnect, the eighth via being within an overlapping portion of the sixth track and the third track.