Semiconductor package with multi-section conductive carrier

摘要

In one implementation, a power semiconductor package includes a non-contiguous, multi-section conductive carrier. A control transistor with a control transistor terminal is coupled to a first section of the multi-section conductive carrier, while a sync transistor with a sync transistor terminal is coupled to a second section of the multi-section conductive carrier. The first and second sections of the multi-section conductive carrier sink heat generated by the control and sync transistors. The first and second sections of the multi-section conductive carrier are electrically connected only through a mounting surface attached to the power semiconductor package. Another implementation of the power semiconductor package includes a driver IC coupled to a third section of the multi-section conductive carrier. A method for fabricating the power semiconductor package is also disclosed. The power semiconductor package according to the present disclosure results in effective thermal protection, current carrying capability, and a relatively small size.

主权项

1. A power semiconductor package comprising:
a multi-section conductive carrier; a first power transistor coupled to said multi-section conductive carrier; a second power transistor coupled to said multi-section conductive carrier; said multi-section conductive carrier sinking heat generated from at least one of said first and second power transistors; said first and second power transistors of said multi-section conductive carrier being electrically connected through a mounting surface attached to said power semiconductor package.