Sawing underfill in packaging processes

摘要

A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.

主权项

1. A method comprising:
bonding a first and a second package component on a top surface of a third package component; dispensing a first polymer, wherein the first polymer comprises:
a first portion in a space between the first and the third package components;a second portion in a space between the second and the third package components; anda third portion in a gap between the first and the second package components; performing a curing on the first polymer; after the curing, sawing the third portion of the first polymer to form a trench between the first and the second package components, wherein the trench has a bottom higher than a top surface of the third package component; and after the step of sawing, molding the first, the second, and the third package components with a second polymer, wherein the second polymer is filled into the trench.