发明名称 Diffusion agent composition, method of forming impurity diffusion layer, and solar cell
摘要 A diffusion agent composition including an impurity-diffusing component (A); a binder resin (B) that thermally decomposes and disappears below a temperature at which the impurity-diffusing component (A) begins to thermally diffuse; SiO2 fine particles (C); and an organic solvent (D) that contains an organic solvent (D1) having a boiling point of at least 100° C.
申请公布号 US9620367(B2) 申请公布日期 2017.04.11
申请号 US201013391907 申请日期 2010.08.18
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 Hirai Takaaki;Murota Atsushi;Tanitsu Katsuya
分类号 H01L21/225;H01L31/02;C09D133/02;C09D133/10;C09D133/12;C09D177/00;H01L21/228;H01L21/22;H01L31/068;H01L31/18 主分类号 H01L21/225
代理机构 Knobbe Martens Olson & Bear LLP 代理人 Knobbe Martens Olson & Bear LLP
主权项 1. A diffusing agent composition used to print an impurity diffusion component onto a semiconductor substrate, comprising: an impurity diffusion component (A): a binder resin (B) that thermally decomposes and disappears below a temperature at which the impurity-diffusing component (A) starts to thermally diffuse into the semiconductor substrate, wherein the binder resin (B) comprises an acrylic resin comprising at least one polymerizable monomer selected from the group consisting of methyl methacrylate (MMA), methacrylic acid (MAA), isobutyl methacrylate (i-BMA), tertiary-butyl methacrylate (t-BMA), acrylic acid, ethyl acrylate, methyl acrylate, butyl acrylate, isobutyl acrylate, ethyl methacrylate, and butyl methacrylate; a SiO2 fine particle (C); and an organic solvent (D) comprising an organic solvent (D1) having a boiling point of at least 100° C., wherein the amount of the impurity-diffusing component (A) is 5 to 9 percent by mass with respect to the entire mass of the composition and 5 to 50 percent by mass with respect to the entire mass of the following solid components of the composition: the impurity-diffusing component (A), the binder resin (B), and the SiO2 fine particle (C).
地址 Kawasaki-Shi JP