Chip-component structure

摘要

A chip-component structure includes an interposer and a multilayer capacitor mounted thereon. The interposer includes a substrate, a component connecting electrode, an external connection electrode, and a side electrode. The component connecting electrode and the external connection electrode are electrically connected by the side electrode. The component connecting electrode is joined to an external electrode of the multilayer capacitor. The substrate includes a communication hole that communicates between opposite spaces opening in both principal surfaces of the substrate.

主权项

1. A chip-component structure comprising:
a multilayer capacitor including a laminated body including a plurality of dielectric layers and a plurality of internal electrodes stacked on each other, and a pair of external electrodes provided on a side surface of the laminated body and electrically connected to the internal electrodes; and an interposer including a substantially flat plate-shaped substrate, a pair of component connecting electrodes provided on a component mounting surface defining one principal surface of the substrate and joined to a respective one of the pair of external electrodes, a pair of external connection electrodes provided on a mount surface defining the other principal surface of the substrate, and a side electrode provided on a side surface of the substrate intersecting the component mounting surface and the mount surface to electrically connect a respective one of the pair of component connecting electrodes and a respective one of the pair of external connection electrodes; wherein the substrate includes a communicating portion that communicates between a space on the mount surface and a space between the component mounting surface and the multilayer capacitor; the communicating portion is defined by at least one open hole having a circular or substantially circular shape; all portions of the laminated body of the multilayer capacitor are disposed outside of the communicating portion; and the communicating portion is located between the pair of external electrodes when the multilayer capacitor and the interposer are viewed in a direction perpendicular to the principal surfaces of the substrate.